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CompactPCI平台

Advantech 的 CompactPCI 与 VPX 解决方案是利用最新技术所设计,能为强固型设计、耐用性、热插入及 CT 总线提供绝佳支持。 上述所有特色都融合在简便扩充的「欧规卡 (Eurocard)」CPCI 与 VPX 尺寸规格之中。 凭借在 CompactPCI 周边适配卡与系统设计十多年的丰富经验,我们已经为世界各地的 OEM 厂商供应了数以千计的产品。 Advantech 的 CompactPCI 平台广泛用于关键的工业及电信应用领域,这些领域对于高可靠性、可用性、服务性以及长期可升级性与可管理性具有高度的要求。 Advantech 的支持团队及合作伙伴十分重视本地的专业技能的与经验,提供现场咨询服务为您处理最新设计的驱动程序与软件兼容性问题。

产品型录

  • 3U VPX

    Advantech 3U VPX blades are OpenVPX-compliant, with long lifecycle support and high quality. Leveraged from Advantech’s renowned development experience, the 3U VPX blades provide high speed, low latency and scalable interconnectivity to signal processing, storage and I/O cards. All with extended operating temperature support (-40 to 70 °C, check with the Advantech representatives for 85°C SKU availability) and verified by the severe reliability tests, the Advantech 3U VPX blades are tailored to the harsh environments, and are able to be adapted to vast heatsink designs. These blades support Linux, Windows and VxWorks operating systems for maximum development flexibility. In addition, customers can leverage Advantech’s design and customization capabilities to integrate application specific features into their COTS blades or develop fully personalized VPX blade designs.

    • MIC-6330

      Based on the Intel® 6th Generation Core® and Xeon® E3 L v5 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (from one port to four ports) of PCI Express gen.3 via the backplane to the highest performance mainstream peripherals and I/O cards,, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by Intel’s integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard conduction-cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 3rd, 4th UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
  • VPX

    以 VPX 标准为架构的新一代嵌入式运算系统反映出日趋重要的高速序列交换式结构互连,这些系统提供更强大的功能,渐渐取代本机通讯的传统平行通讯总线架构。 研华的 VPX 产品线利用全新的高速连接器为交换式结构提供支持,特别着重于防护式应用,采用能为应用程序及平台提供卓越效能的增强型模块标准。

    • MIC-6314

      The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the Intel® 4th/ 5th Generation Core® embedded platform with the increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native conduction-cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel’s latest Gigabit Ethernet controller. Intel’s next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
    • MIC-6313

      The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the Intel® 4th/ 5th Generation Core® and Xeon® E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the Intel® 4th/ 5th Generation Core® and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native conduction-cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a cost-efficient, modular storage. By using Intel’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by intel’s latest Gigabit Ethernet controller. Intel’s next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
    • MIC-6311

      Advantech’s MIC-6311 is a single processor VPX blade based on the Intel® 4th generation Core® i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Core® processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support conduction-cooling heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using Intel’s latest powerful PCH (Lynx Point) with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by intel’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers the up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
  • 3U CompactPCI

    Advantech 3U CompactPCI Enclosures support CPCI platforms and CPCI chassis. Advantech works closely with CompactPCI® enclosure manufacturers and supply a wide range of chassis from 1U to 12U.

  • 6u CompactPCI板

    包含 Advantech 的 Intel® 架构 6U CompactPCI 单板计算机、后走线模块及周边机板 (包括 XMC 与 PMC)。 Advantech 的 6U CompactPCI、XMC 及 PMC 支持众多的工业自动化事业部产品。 工业通讯与数据撷取适用的 3U CompactPCI 产品。 单击此链接了解完整信息。

    • 主CPU板

      研华 CompactPCI 单板计算机可用于许多配置。 机板涵盖从关键应用所需的高效能 CPU 机板,到适合多用途跨产业应用的更全面处理器机板。 我们的高效能 6U CompactPCI 机板采用最新的处理器技术,能针对加速、卸除、绘图、网络及储存提供卓越的 I/O 扩充性。
    • Carrier Boards

      Carrier Boards
    • 后面传输板

      研华提供 CompactPCI 后走线板,以符合各种 CompactPCI 平台的需求。 我们提供最齐全的 CompactPCI 后走线板,方便接取 研华CPU 机板的 I/O 接口。
  • 6u CompactPCI机箱

    Advantech 与许多供应 1U 至 12U 机壳的 CompactPCI® 机柜制造商保持密切合作关系。 我们提供 6U CompactPCI 机柜,为您的 CPCI 平台与 CPCI 机壳提供支持。

    • for 6U CompactPCI

      for 6U CompactPCI
    • 4U机柜

      研华提供 4U 机柜,以符合各种 CompactPCI 机柜 (CPCI 机柜) 的需求。 具有高可用性的 CompactPCI 8 插槽机柜标榜充足的扩充空间,适合用于运算密集的刀锋服务器 (服务器弹性音频路由矩阵) 及中等规模的新世代网络应用,例如网络电信交换机及讯号网关。 研华的 CompactPCI 机柜是 CompactPCI 的最佳选择。
  • CompactPCI Peripherals

    Advantech 的 CompactPCI 解决方案包含 CPCI 周边机板及载板,是利用最新技术所设计,能为强固型设计、耐用性、热插入及 CT 总线提供绝佳支持。 上述所有特色都融合在简便扩充的「欧规卡 (Eurocard)」CPCI 尺寸规格之中。 Advantech 持续履行开发、供应及支持 CompactPCI® 产品线的承诺。 凭借在 CompactPCI 周边机板与系统设计十多年的丰富经验,我们已经为世界各地的 OEM 厂商供应了数以千计的产品。 Advantech 的 CompactPCI 平台广泛用于关键的工业及电信应用领域,这些领域对于高可靠性、可用性、服务性以及长期可升级性与可管理性具有高度的要求。 Advantech 的 CompactPCI 载板是采用最新的 Intel® 硅芯片所设计,为旧型产品提供全面的升级管道,并为全新设计奠定坚实的基础。

    • PMC模块

      研华提供全系列 CPCI 接口设备适用的 CPCI PMC 模块。 CPCI PMC 模块包含多种 IEEE P1386.1 PMC 规范兼容模块,适用于 CPU 机板的 LAN 联机能力扩充。
    • 报警模块

      研华提供警报模块,以符合各种 CompactPCI 周边模块的需求。 研华利用独立于系统之外作业的智能型监控模块来侦测系统异常状况,并允许用户在发生系统故障之前采取措施,是 CompactPCI 接口设备的最佳选择。

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