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TPC-107W

7" 边缘可视化平台,搭载 ARM Cortex™-A53 处理器

  • NXP® ARM® Cortex™-A53 i.MX 8M Mini四核处理器
  • 7" 16:9 LCD屏幕,支持 P-CAP多点触控, IP66 级前面板
  • 板载2 GB DDR4 RAM 和 16 GB eMMC 存储
  • 2 x 10/100/1000 Mbps LAN,支持可选的 IEEE 802.3at/af PoE-PD 模块
  • 1 mb FRAM 备份内存用于意外电源中断
  • 2 x 120Ω 终端电阻串行端口,其中一个支持 CAN 2.0B 协议并提供高达 1 Mb/sec 的可编程比特率
  • 嵌入式浏览器用于快速 Web 应用程序开发
  • 支持 Linux Yocto 和 Android系统
  • 可选和 mPCIe 扩展模块

认证:

规格

Touchscreen
Touch Type
  • PCAP
  • PCAP
LCD Display
Display Size
  • 7"
  • 7"
Max. Resolution
  • 1024 x 600
  • 1024 x 600
Luminance (cd/m2)
  • 425
  • 425
Backlight Life (hrs)
  • 50,000
  • 50,000
Hardware
CPU
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
Memory
  • 1 x LPDDR4 with 4 GB
  • 1 x LPDDR4 with 4 GB
Storage
  • 1 x eMMC (16 GB), 1 x micro SD Slot
  • 1 x eMMC (16 GB), 1 x micro SD Slot
Expansion
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
Certification
  • CB, UL, CE, FCC Class A, CCC, BSMI
  • CB, UL, CE, FCC Class A, CCC, BSMI
OS Support
  • Linux Yocto
  • Android
Power Input
  • 24 VDC ±20%
  • 24 VDC ±20%
I/O Interface
USB Ports
  • 2 x USB 2.0
  • 2 x USB 2.0
LAN Ports
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
Serial Ports
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
Mechanical
Enclosure
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
Mounting
  • VESA, Panel
  • VESA, Panel
Weight (Net)
  • 2 kg (4.41 lb)
  • 2 kg (4.41 lb)
Environment
Ingress Protection
  • Front Panel IP66
  • Front Panel IP66
Operating Temperature
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)
Storage Temperature
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
Relative Humidity
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
Shock Protection
  • 10 G, half sine
  • 10 G, half sine
Vibration Protection
  • 2 Grms, random
  • 2 Grms, random
Isolation Protection
  • Chassis grounding protection
  • Chassis grounding protection