Vision AI technology plays a crucial role in inspecting chip packaging and surface quality in semiconductor manufacturing. It detects physical defects such as cracks, warping, and misalignment in the final product, ensuring chips meet rigorous quality standards. Additionally, Vision AI verifies the accuracy of labeling and branding, making sure all markings on the chip packages are correct and legible. For chips requiring soldering or bonding, Vision AI ensures precise alignment in die bonding, wire bonding, and solder joints, increase the manufacturing process's accuracy and efficiency, thereby enhancing product reliability and performance.